by Jeffrey Shen Jeffrey Shen

HKE CTO Doug Sparks to Moderate Panel at MEMS Manufacturing 2022

Join Doug for an exciting line up of speakers regarding MEMS manufacturing March 1-3, 2022

Conference Topics

  • Global trends: market drivers, emerging applications, intellectual property factors, business roadmaps, government policy effects.
  • Technology aspects: process selection and development, PDKs and design rules, design for manufacturing, scaling, yield improvement, IP blocks, rapid prototyping, high volume production.
  • Business aspects: competitive and market dynamics, “pure play” foundries vs. platform-based design approaches, technology transfer, IDM vs. fabless approaches, supply chain challenges, ecosystem development, cost management and reduction.
  • Emerging technologies and processes: TSVs, 3D stacking, wafer level packaging, CMOS MEMS integration, EDA software and simulation tools, polymer and glass microfabrication, novel materials and coatings, lamination techniques, ultra-thin and flexible substrates.
  • Packaging, testing, and reliability: equipment, tools, methodologies, case studies.

MEMS manufacturing in China: recent trends and ecosystem developments
Doug Sparks, PhD
CTO and Executive Vice President
Hanking Electronics

China is seeing a dramatic surge in the growth of infrastructure for MEMS manufacturing. More than $160 billion dollars will be spent in China’s semiconductor industry in the next few years, at a rate of more than $10 billion per year. A significant portion of that investment will go into the MEMS segment. China is seeing a MEMS manufacturing transition from 100 and 150mm wafers to 200mm wafers, as well as a transition from government-institute fabs to commercial MEMS fabs and foundries. In addition, the high–volume MEMS manufacturing segment in China was previously post-wafer packaging and test, but now it is encompassing the entire wafer fabrication flow of the production cycle. This talk will provide a comprehensive overview of the major MEMS players, technology, investments, challenges and related services and devices available in China.

Register today! https://www.memsmanufacturing.com/register.html

by Jeffrey Shen Jeffrey Shen

A 2022 forecast for sensors/MEMS amid COVID, by industry insiders

Our CEO Lucy Huang was featured in this recent article in the latest issue of Fierce Electronics. 

Chip shortages have been seen in the global supply chain in the past year in MEMS as well as ICs (Integrated Circuits). This will drive investment and growth in the MEMS foundry business. Prior to the COVID shutdowns, the MEMS foundry business in China had already moved from 100- & 150-mm MEMS fabs as well as CMOS (Complementary Metal Oxide Semiconductor) surface micromachining to large 200mm MEMS wafer fabs.

There are several different basic MEMS process technologies such as capacitive, piezoresistive, magnetic and piezoelectric processes. To accommodate this range of processes a foundry must be flexible to meet a wide range of customer requirements. Materials like gold, scandium, zirconium, and process that are not compatible with CMOS foundries are able to be manufactured in dedicated MEMS wafer fabs.

This approach enables new technologies and materials like piezoelectric and IR sensors and actuators to be fabricated for large volume consumer applications. Turn-key solutions with PDKs (Process Design Kits) and developed processes are preferred by global and Chinese customers and Hanking Electronics offers design-fab-assembly services. We see many foundry customers who want to expand more local, Chinese wafer fab content to meet regional needs going forward into 2022 and beyond.

Read the full article