Jen Baird, CEO, Board Member at Fifth Eye
Successfully Getting a Software Medical Device Built and Approved for Marketing in the U.S. (20 min)
To market a software medical device in the U.S., companies must secure authorization from the U.S. FDA to sell. This talk will use a newly authorized hemodynamic status monitor that uses a single lead of ECG to identify signs of hemodynamic instability as a case study. Learn the differences, advantages, and disadvantages of the most common FDA medical device clearance pathway, the 510(k), with the path provided for novel devices, the De Novo pathway. The successful serial entrepreneurial CEO of a venture-backed U.S. startup will share her keys to success and lessons learned over the past four years pursuing both paths.
Roger Grace, Founder and President at Roger Grace Associates
Commercialization Challenges and Opportunities for Printed, Flexible, Streachable and Functional Fabic Sensors in IoT, Wearables and other High-Volume Applications
The presentation will provide an overview of printed, flexible, stretchable, functional fabric sensors and accompanying electronics and the applications currently enabled as well as future application opportunities. Examples from current suppliers as well as highlights from leading international research organizations will be addressed.
- Motivation and benefits to use these sensors versus alternative solutions
- Challenges of their integration with other functional element of basic Internet of Things (IoT) and wearable applications
- Manufacturing issues to create these heterogeneous and hybrid solutions from a materials, printing and assembly a.k.a. “converter” perspective
- Barriers to the successful commercialization of these sensors and recommended strategies for market success
Kalyan Handique, VP of CDG Advanced Technology at HandyLab and Celsee
Commercialization and entrepreneurial lessons from two microfluidic startups HandyLab and Celsee
In this case-study seminar, Kalyan will go through his journey in commercializing cutting edge products for life sciences and diagnostics through two of his medical microfluidic start-ups HandyLab and Celsee, providing insights into the technology involved in genomic or single cell analysis. HandyLab’s microfluidic device is used in medical disease diagnosis and was acquired by Becton Dickinson. Celsee offered a disposable single cell detection and analysis system that was acquired last year by BioRad.
Lucy Huang, CEO at Hanking Electronics
High Volume MEMS Foundries
MEMS wafer fabrication has traditionally been dominated by IDM corporations, making their own MEMS wafers. In recent years, fabless MEMS companies have risen to take significant market share in the growing spaces that MEMS devices are fabricated for. Along with fabless design firms, MEMS foundries have grown in the last decade, first making 100 and 150mm wafers, but more recently expanding to 200mm wafer foundries. This talk will discuss the challenges of high volume MEMS wafer foundries as well as growth areas for this business model.
Paul Krake, Co-Founder at US/China Series
China’s Supply Chain Adjustment Strategies
Tech Nationalism, an Inward-Looking China; a Digital Iron Curtain; These are all expressions to describe the apparent technology decoupling between the United States and China. While it can be argued that complete decoupling is next to impossible, domestic security concerns and the promotion of indigenous technologies for domestic use cases will ensure a technology rivalry that will get more intense in the years ahead. Domestic semiconductor self-reliance is at the center of this, but it is so much more than supply chain self-sufficiency. This will play a vital role in determining the extent of technology engagement throughout the Biden administration and beyond.
Mary Ann Maher Ph.D., CEO & Founder at SoftMEMS
Digital Twins in MEMS and Sensors Design
MEMS and Sensors design is challenging due to the use of unique materials, fabrication processes and packaging. This talk discusses how Digital Twins can be used to address these challenges and facilitate collaborations and interaction between design, simulation, manufacturing and product engineering teams. Digital Twins link design, physical manufacturing and measured performance data and may be applied in many phases of the design process from materials design optimization all the way to artificial intelligence algorithm training as well as testing and qualification. The talk will provide an introduction to Digital Twins and several examples of their use in MEMS based product design.
Muru Meyyappan, Director of Test Engineering at Inphi Corporation
High speed test infrastructure and challenges in testing Datacenter / 5G products
Data center and 5G cellular network technologies are driving connectivity for the next generation of application seamlessly with high security and reliability. As 5G envisions connecting billions of devices, supporting with higher data rates with lower latencies, Hyperscale data centers becoming important due to massive data demands that is spiking to new levels through the data explosion of new IoT and edge computing needs.
With exploding data rates and integration of computing/connectivity solutions in silicon, testing highspeed components or connectivity solutions like DSP based re-timers, trans impedance amplifiers, different types of drivers and modules in high volume become more challenging than ever before. We will explore the test infrastructure to enable testing of those components/modules starting from test hardware design, signal integrity environments, highspeed test accessories / add-ons available in the market for prototype validation, associated impediments/challenges of highspeed testing in high volume manufacturing along with upcoming trends in bare silicon die probing at speed.
Marco Mezger, CEO at APIS4
What’s up in the Memory (DRAM) and Storage (SSD) Market
Memory (volatile and non-volatile) is one of the largest segments in the semiconductor market. With consolidation on the one side and new players in China on the other side, it is important to understand where we are today and also taking a quick outlook on what could come next with new emerging memory technologies.
Tom Nguyen, Board Member at MANCEF
MEMS / Semiconductor Development in Vietnam
MEMS (micro-electro-mechanical systems) technology and semiconductor have been around the world for more than 50 years of development, with significant technology advancement and successful commercialization of many single functional MEMS devices and as well as combined MEMS sensors and ASICS for signal conditioning products such as pressure sensors, accelerometers, gyroscopes, microphones, micro-mirrors, etc… and, it has been identified as one of the most promising technologies for today and the future to serve various industrial, consumer, automotive, and medical markets and it will continue to grow and potentially affect our daily lives and the way we live today and in the future of the smart city, autonomous driving, IoT, and internet of everything.
In this context of MEMS and semiconductor technology, this paper will introduce more potential growth in the MEMS and semiconductor development, applications, and market in Vietnam.
Andrew Oliver, Sr. Research Engineer (ECE) at Montana State University
Dr. David Dickensheets, Professor of Electrical & Computer Engineering at Montana State University
Micro-Optical Devices and their Applications in LIDAR
Over the past two decades, MEMS mirrors have evolved into high performance beam scanning devices. Because of their small mass, MEMS mirrors can be fast and are more immune to platform vibration, acceleration, and mechanical shock than larger mirrors. Their small mass and inertia allows for fast acceleration and agile beam pointing. In addition, MEMS devices are small and often have simple electrical interfaces. Thus, they can increase system performance without increasing the size, weight or power of the system. This paper reviews the state of the art in MEMS mirrors with an emphasis on their use in LIDAR including both academic and commercial developments. The talk then analyzes the commercialization potential of these technologies and the forces that will make these developments successful or unsuccessful in the marketplace. For example, in automotive applications, the need to support products for more than a decade and the liability associated with product failure will limit the ability of small companies to compete with established suppliers.
Chetan Arvind Patil, NPI/NTI Product Engineer at NXP
The Status Of Semiconductor Manufacturing In India
Global semiconductor industry sales have been increasing steadily over the last decade and are on track to touch $500 Billion by 2021. Asia’s share is 40% (mainly due to semiconductor manufacturing) with India lagging way behind with less than 1% (mostly design and assembly). While India is home to top design houses, it certainly is way behind in semiconductor manufacturing compared to its neighbors. With the growing dependence and share of semiconductors in day-to-day technology along with India’s growing semiconductor consumption (smart devices to cars), it is time for India to push for in-country semiconductor manufacturing. This talk showcases the past and present of semiconductor manufacturing in India along with the opportunities to make India a global destination for semiconductor manufacturing.
Robert Quinn, Founder and President at Quinn Media Management
The Continued Industry Growth of 8″ Wafer Fabs
This speech will review and talk about the Continued Industry Growth of 8″ Wafer Fabs. According to the data that was collected from multiple trusted news sources I was able to gather key industry facts supporting my overview of the 200mm semiconductor industry. Using this data we are able to conclude that the 200mm Semiconductor industry will continue to see a 17% growth through 2024 and with the new technology of GaN and SiN foundries may deem it unnecessary to transition to 300mm fabs or even advanced nodes for the products they are currently producing. From my view, the 200mm semiconductor industry is here to stay and it will continue to see growth throughout the globe.
Dr. Alessandro Rocchi, Director of Engineering at Hanking Electronics
Advances in Inertial MEMS
Micro-electromechanical systems’ (MEMS) inertial measurement units (IMUs) have become increasingly popular, and they can be found today in a vast variety of applications.
The first broad commercial adoption occurred during the late 1980s and the 1990s under the push of the increasing safety demand in automotive market, first with MEMS linear accelerometers for airbags and later with vibration gyroscopes for vehicle stability control.
However, we must wait until 2006 with the launch of the Nintendo Wii to see the real explosion of MEMS inertial devices. At the heart of the success of the Wii is the accelerometer inside the Wiimote that detects motion in three-dimensional space. A technology that will be soon adopted by Apple for its first iPhone and expanded few year later, in 2010, with the iPhone4 where a gyroscope was added to complement the accelerometer, hence completing the first IMU in a consumer application.
Since then, MEMS inertial devices has enabled exciting applications in portable devices, including optical image stabilization for camera performance improvement, the user interface for additional features and ease of use, and gaming for more exciting entertainment. However, looking at today’s MEMS inertial devices after more than 20 years of commercial successes, two things can be noticed: ASP dropped down by more than a factor 10x, while design and technology almost did not evolve. Is this the sign that MEMS inertial devices are getting close to their end?
Leonardo Sala, Dir. of Technical Marketing & Support at Hanking Electronics
COVID-19 impact on MEMS applications: shift in products, new directions and new opportunities.
COVID-19 has affected global markets in different ways. For instance, the impact on medical and telecommunications has been positive, whereas automotive and mobility in general have been adversely impacted. The effects on the consumer, mobile and industrial markets have been limited. During the pandemic, some types of MEMS have even dramatically surged in demand, like thermopiles and microbolometers used in thermal cameras or contactless thermometers, driven by the need for monitoring people’s temperatures. In parallel, microfluidics for DNA sequencing PCR diagnostic tests for detecting COVID-19 are coming to market prominence, propelled by the need to detect with high accuracy the presence of the virus. Similarly, pressure and flowmeters in ventilators will grow because of huge demand by hospital intensive care units. These and other considerations about how COVID-19 has re-shaped and are still modifying the MEMS market will be developed in the talk.
Nicolas Sauvage, Managing Director at TDK Venture
Corporate VCs accelerating success of innovative hard-tech startups
TDK Ventures is the Corporate Venture arm of TDK, a technology-focused venture fund, investing globally in early-stage startups that leverages fundamental material science. The presentation will share how innovative companies can tailor their messaging towards CVCs for best impact.
Dr. Doug Sparks, CTO at Hanking Electronics
The Semiconductor & MEMS Ecosystem in China
China has seeing a dramatic surge in the growth of infrastructure for semiconductors and MEMS manufacturing in the last decade. Established IC giants like Intel, Samsung, TSMC and SK Hynix have bult 300mm wafer fabs and Chinese firms like SMIC have also built semiconductor foundries there as well. Semiconductor equipment suppliers have also installed significant resources to support the industry in China and the surrounding region. A significant portion of that investment will be go to the sensors and MEMS segment. China has seeing a MEMS manufacturing transition from 100 & 150mm wafers to 200mm wafers as well as a transition from government institute fabs to commercial MEMS fabs and foundries. In addition, the high-volume MEMS manufacturing segment in China was previously post wafer packaging and test, but now is encompassing the entire wafer fabrication portion of the production cycle. This talk will cover the major players, technology, investment, challenges and related to semiconductors and MEMS capabilities in China.
David Tolfree, VP of Europe at MANCEF
Micro-Nano, Emerging and Enabling Technologies and the Knowledge Transfer Network Infrastructure in the UK
To understand the success of the current UK infrastructure for supporting industry to commercially benefit from advances in new technologies requires a knowledge of its evolution back in the late 1990s. In 2003 a national Micro-Nanotechnology Network (MNT) supported by government and industry was formed. Up to 2006 the number companies in the UK manufacturing and supplying products based on MNTs increased from 100 to 700. Changes in government policy in 2007 towards science, technology and industry produced a successor to the MNT network. Sixteen Knowledge Transfer Networks (KTNs) were established under the auspices of a Technology Strategy Board.
The mission of the KTNs is to connect people to accelerate innovation and identify markets. They bring together businesses, entrepreneurs, academics and funders to develop new products, processes and services to create value and benefit society. The KTNs have an online community of over 60,000 members and through its events brings together over 20,000 delegates.
In 2014 the Technology Strategy Board name was changed to Innovate UK to become the nation’s innovation agency with a current R&D budget in excess of £14.8 billion. Its mission is to accelerate economic growth by funding, supporting and connecting innovative businesses programmes.
In this presentation, the current infrastructure based the UK’s Innovate KTNs will be given together with examples of the key current programmes and projects being supported by the KTN’s Emerging and Enabling Technologies teams working with the Electronics, Photonics, Sensor, Quantum and ICT sectors. A particular reference will be made to the commercialisation challenges brought about by the current virus pandemic.
Dr. John Malcolm Wilkinson, CEO at Kirkstall Ltd.
Animal Testing replacement could be the biggest market for organ on a chip microphysiological systems by 2027
Malcolm retired as CEO of Kirkstall Ltd, one of the world’s leading Organ on a Chip companies, in 2019. He is now busier than ever helping research organisations and charities working to replace the use of animals. Previously in his career he had senior roles in both R&D and sales and marketing. He founded a consulting company which supported spin-outs from Universities and raised over $15 million from Venture capital and regional development funds.He was a visiting Lecturer for FSRM, Neuchatel, Switzerland, on the subject of Micro and Nanotechnology in Biomedical Engineering from 1994 to 2019. Malcolm was appointed as a Visiting Professor in the Department of Biomedical Engineering at Sheffield University in 2019. Dr Wilkinson is co-author on several papers on in-vitro models of toxicity and a contributing editor of a recently published book on In-Vitro Testing.
Taguhi Yeghoyan, Director, Public Relations at Yole Development
Lithography and Bonding Equipment in growing MEMS and Sensors Market for Consumer and Automotive Applications
MEMS and Sensors represent a vast number of device technologies which are present in all megatrends, including Consumer and Automotive. Covid-19 pandemic had a profound influence on those two end-markets. In 2020, Consumer end-market size decreased of 2.6% YoY and Automotive end-market size decreased even up to 27.5%. Nevertheless, by 2025, COVID-19 pandemic influence should fade away and MEMS device market should increase by 7.4% CAGR. Despite strong MEMS market size decrease, the lithography and bonding equipment market serving it, is stable. Regarding consumer end-market, the fab capacity increase will be led mostly by projection lithography tools acquisition for RF BAW filters for 5G expansion (device CAGR of 15.5%) as well as sound processing MEMS (device CAGR of 5.4%). Regarding Automotive endmarket, the lithography tools investment should be led by inertial MEMS and their integration with digital units. Total lithography equipment market for MEMS and Sensors manufacturing is expected to grow with 4% CAGR. The following years will also show adoption of Maskless Lithography equipment which can potentially address the photomask-related manufacturing cost. A general MEMS integration trend leads the bonding equipment market increase with CAGR above 10%. This presentation aims to give an overview of MEMS and Sensors lithography and bonding market, the latest device manufacturing breakthroughs and remaining challenges.
For details regarding sponsorship, abstracts, posters and exhibit opportunities, please email Doug Sparks email@example.com
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