by Jeffrey Shen Jeffrey Shen

HKE CTO Doug Sparks to Moderate Panel at MEMS Manufacturing 2022

Join Doug for an exciting line up of speakers regarding MEMS manufacturing March 1-3, 2022

Conference Topics

  • Global trends: market drivers, emerging applications, intellectual property factors, business roadmaps, government policy effects.
  • Technology aspects: process selection and development, PDKs and design rules, design for manufacturing, scaling, yield improvement, IP blocks, rapid prototyping, high volume production.
  • Business aspects: competitive and market dynamics, “pure play” foundries vs. platform-based design approaches, technology transfer, IDM vs. fabless approaches, supply chain challenges, ecosystem development, cost management and reduction.
  • Emerging technologies and processes: TSVs, 3D stacking, wafer level packaging, CMOS MEMS integration, EDA software and simulation tools, polymer and glass microfabrication, novel materials and coatings, lamination techniques, ultra-thin and flexible substrates.
  • Packaging, testing, and reliability: equipment, tools, methodologies, case studies.

MEMS manufacturing in China: recent trends and ecosystem developments
Doug Sparks, PhD
CTO and Executive Vice President
Hanking Electronics

China is seeing a dramatic surge in the growth of infrastructure for MEMS manufacturing. More than $160 billion dollars will be spent in China’s semiconductor industry in the next few years, at a rate of more than $10 billion per year. A significant portion of that investment will go into the MEMS segment. China is seeing a MEMS manufacturing transition from 100 and 150mm wafers to 200mm wafers, as well as a transition from government-institute fabs to commercial MEMS fabs and foundries. In addition, the high–volume MEMS manufacturing segment in China was previously post-wafer packaging and test, but now it is encompassing the entire wafer fabrication flow of the production cycle. This talk will provide a comprehensive overview of the major MEMS players, technology, investments, challenges and related services and devices available in China.

Register today! https://www.memsmanufacturing.com/register.html

by Jeffrey Shen Jeffrey Shen

Hanking Organizer of China COMET 2021 Featured in CMM Magazine’s October Issue

Hanking Electronics is the organizer of China COMET 2021 and was featured in the October issue of CMM Magazine. Hanking partnered with MANCEF in launching a new China chapter and bringing the COMET conference to China. The virtual conference was held online September 16-17 and the live conference will be held in Shenyang, China November 22-23, with a tour of Hanking’s high volume MEMS fab.

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MANCEF COMS World 2020

注册COMS World 2020, 了解中国MEMS/半导体 基础设施建设恢复情况。

Register for COMS World 2020 and learn about the resilience of the MEMS/Semi infrastructure in China

以下是此次分会的演讲嘉宾  Here are the speakers we have for this session: Lucy Huang (罕王微电子 CEO-Hanking Electronics), Sara Sun (KLA-SPTS), Jerry Li (沈阳硅基 Shenyang Silicon), Mike Rosa (AMAT), Eric Pabo (EVG), Roc Blumenthal, Tomas Bauer (Silex) and Doug Sparks. ( 罕王微电子 CTO-Hanking Electronics)

Hanking Electronics is a proud Bronze Sponsor of MANCEF COMSWORLD 2020. Our CEO, Lucy Huang and CTO, Dr. Doug Sparks will be speakers at this event. Register today! https://comsworld2020.com/
#mems #sensors #technologies #healthcare #security #environment #nanotechnology #iot #onlineevent #coms2020 #hankingelectronics #inovation

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Hanking’s Dir. of Technical Marketing & Support to Speak at Electronica

Leonardo Sala, Hanking’s Dir. of Technical Marketing and Support, will be a speaker at Electronica 2018 in Shanghai on MEMS technology.  Leonardo will discuss Hanking’s MEMS technology, that includes 3 DoF and 6DoF inertial sensors and China’s first high volume 8″ MEMS wafer foundry.  His speech will address Hanking’s development of its future to become the world leader in MEMS technology.

For more information: http://www.electronicachina.com/