by Jeffrey Shen Jeffrey Shen

A 2022 forecast for sensors/MEMS amid COVID, by industry insiders

Our CEO Lucy Huang was featured in this recent article in the latest issue of Fierce Electronics. 

Chip shortages have been seen in the global supply chain in the past year in MEMS as well as ICs (Integrated Circuits). This will drive investment and growth in the MEMS foundry business. Prior to the COVID shutdowns, the MEMS foundry business in China had already moved from 100- & 150-mm MEMS fabs as well as CMOS (Complementary Metal Oxide Semiconductor) surface micromachining to large 200mm MEMS wafer fabs.

There are several different basic MEMS process technologies such as capacitive, piezoresistive, magnetic and piezoelectric processes. To accommodate this range of processes a foundry must be flexible to meet a wide range of customer requirements. Materials like gold, scandium, zirconium, and process that are not compatible with CMOS foundries are able to be manufactured in dedicated MEMS wafer fabs.

This approach enables new technologies and materials like piezoelectric and IR sensors and actuators to be fabricated for large volume consumer applications. Turn-key solutions with PDKs (Process Design Kits) and developed processes are preferred by global and Chinese customers and Hanking Electronics offers design-fab-assembly services. We see many foundry customers who want to expand more local, Chinese wafer fab content to meet regional needs going forward into 2022 and beyond.

Read the full article

by Jeffrey Shen Jeffrey Shen

Hanking Organizer of China COMET 2021 Featured in CMM Magazine’s October Issue

Hanking Electronics is the organizer of China COMET 2021 and was featured in the October issue of CMM Magazine. Hanking partnered with MANCEF in launching a new China chapter and bringing the COMET conference to China. The virtual conference was held online September 16-17 and the live conference will be held in Shenyang, China November 22-23, with a tour of Hanking’s high volume MEMS fab.

CMM COMS2021_14.5Download
by Jeffrey Shen Jeffrey Shen

Advances in MEMS-based Inertial Sensors

By Doug Sparks, CTO at Hanking Electronics

Microelectromechanical system (MEMS)-based inertial sensor commercialisation goes back around 50 years and has involved many interesting developments, new applications and acquisitions. Development of capacitive and piezoresistive silicon linear accelerometers began in the 1970s1. Airbags were the first high-volume application for these inertial sensors in the late 1980s and early 1990s. As with many MEMS devices, the aerospace industry led the development of angular rate sensors, also known as MEMS gyroscopes. Like the accelerometer, the automotive market provided the first high-volume applications for MEMS gyroscopes, starting in the mid-1990s2 with navigation assist, vehicle dynamic control (VDC) and roll-over protection (ROP) systems. Now, both of these sensors can be found in every smartphone, tablet, vehicle and wearable device.

Read the full article on CMM

by Jeffrey Shen Jeffrey Shen

Microsystem and semiconductor commercialisation in China

By Doug Sparks, CTO at Hanking Electronics

China has seen unprecedented growth in microsystem and semiconductor infrastructure in the past decade. This is due to the rise of its automotive and consumer markets and export of smart phones, tablets, drones and other microsystem and semiconductor enabled products. Historically, more than 90 percent of microelectromechanical systems (MEMS) devices such as accelerometers, gyroscopes, pressure sensors and radio frequency (RF) filters have been imported into China for product assembly. Virtually all the MEMS wafers are fabricated outside of the country and imported as wafers, chips or packaged devices. According to customs data, China imported semiconductor and MEMS chips worth US$304 billion in 2019, down 2.6 percent on a yearly basis1. Moreover, the State Council of China has declared that the country aims to increase its self-sufficiency rate of chips to 70 percent from the 30 percent level realised in 2019. This type of semiconductor manufacturing goal and the government funds associated with it have been ongoing for more than a decade. Read the full article on CMM.

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Electronica 2019 Speaker – Leonardo Sala, Dir. of Technical Marketing & Support

Need a MEMS solution? Stop by our booth # E4.4555 at Electronica 2019 to learn more about our MEMS turnkey solutions! Or contact our Sales team for more information or to get a quote 

Leonardo Sala, Hanking’s Dir. of Technical Marketing and Support, will be a speaker at Electronica 2019 in Shanghai on MEMS technology. Leonardo will discuss Hanking’s expertise in MEMS technology and turnkey MEMS solutions that include; 3 DoF and 6DoF inertial sensors, IoT motion tracking modules, custom MEMS design and Hanking’s high volume 8″/ 200mm MEMS wafer foundry services. For more information: https://lnkd.in/efztjm5

#mems #memsfoundry #memsdesign #memsinertialsensors #electronica2019

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Hanking Electronics will Exhibit at Electronica China 2018

 

Hanking Electronics

Stop by our booth to learn more about our MEMS sensors, modules, design services and China’s first high volume 8″ MEMS foundry services.

Electronica 2018: Booth E4.4524

Speaker: Mr. Leonardo Sala, Director of Technical Marketing & Support

http://www.electronicachina.com.cn/zh-cn/exhibitor/detail/1740qW6.html

Exhibition Overview

Electronica China The Shanghai Electronics Show in Munich is an electronics trade show and an important event in the industry. Over the years, the exhibition incarnation e planet has become a platform for innovation to lead the future of electronic technology. Semiconductors, sensors, connectors and power supplies form the heart of Planet, building his landscape, city, and street. e innovative planet to help people a more intuitive understanding of the dynamics behind the development of the electronic world. The audience and exhibitors are its residents, they can easily communicate at any time to witness the global electronics industry trends.

2018 Shanghai Electronics Show ( Electronica China)

Time: March 14th -16th, 2018

Venue: Shanghai New International Expo Center E3, E4, E5, E6, T1 Hall

Organizer: Messe München (Shanghai) Co., Ltd.

Held concurrently: Productronica China (Shanghai)