by Jeffrey Shen Jeffrey Shen

HKE CTO Doug Sparks to Moderate Panel at MEMS Manufacturing 2022

Join Doug for an exciting line up of speakers regarding MEMS manufacturing March 1-3, 2022

Conference Topics

  • Global trends: market drivers, emerging applications, intellectual property factors, business roadmaps, government policy effects.
  • Technology aspects: process selection and development, PDKs and design rules, design for manufacturing, scaling, yield improvement, IP blocks, rapid prototyping, high volume production.
  • Business aspects: competitive and market dynamics, “pure play” foundries vs. platform-based design approaches, technology transfer, IDM vs. fabless approaches, supply chain challenges, ecosystem development, cost management and reduction.
  • Emerging technologies and processes: TSVs, 3D stacking, wafer level packaging, CMOS MEMS integration, EDA software and simulation tools, polymer and glass microfabrication, novel materials and coatings, lamination techniques, ultra-thin and flexible substrates.
  • Packaging, testing, and reliability: equipment, tools, methodologies, case studies.

MEMS manufacturing in China: recent trends and ecosystem developments
Doug Sparks, PhD
CTO and Executive Vice President
Hanking Electronics

China is seeing a dramatic surge in the growth of infrastructure for MEMS manufacturing. More than $160 billion dollars will be spent in China’s semiconductor industry in the next few years, at a rate of more than $10 billion per year. A significant portion of that investment will go into the MEMS segment. China is seeing a MEMS manufacturing transition from 100 and 150mm wafers to 200mm wafers, as well as a transition from government-institute fabs to commercial MEMS fabs and foundries. In addition, the high–volume MEMS manufacturing segment in China was previously post-wafer packaging and test, but now it is encompassing the entire wafer fabrication flow of the production cycle. This talk will provide a comprehensive overview of the major MEMS players, technology, investments, challenges and related services and devices available in China.

Register today! https://www.memsmanufacturing.com/register.html

by Jeffrey Shen Jeffrey Shen

Advances in MEMS-based Inertial Sensors

By Doug Sparks, CTO at Hanking Electronics

Microelectromechanical system (MEMS)-based inertial sensor commercialisation goes back around 50 years and has involved many interesting developments, new applications and acquisitions. Development of capacitive and piezoresistive silicon linear accelerometers began in the 1970s1. Airbags were the first high-volume application for these inertial sensors in the late 1980s and early 1990s. As with many MEMS devices, the aerospace industry led the development of angular rate sensors, also known as MEMS gyroscopes. Like the accelerometer, the automotive market provided the first high-volume applications for MEMS gyroscopes, starting in the mid-1990s2 with navigation assist, vehicle dynamic control (VDC) and roll-over protection (ROP) systems. Now, both of these sensors can be found in every smartphone, tablet, vehicle and wearable device.

Read the full article on CMM

by Jeffrey Shen Jeffrey Shen

Microsystem and semiconductor commercialisation in China

By Doug Sparks, CTO at Hanking Electronics

China has seen unprecedented growth in microsystem and semiconductor infrastructure in the past decade. This is due to the rise of its automotive and consumer markets and export of smart phones, tablets, drones and other microsystem and semiconductor enabled products. Historically, more than 90 percent of microelectromechanical systems (MEMS) devices such as accelerometers, gyroscopes, pressure sensors and radio frequency (RF) filters have been imported into China for product assembly. Virtually all the MEMS wafers are fabricated outside of the country and imported as wafers, chips or packaged devices. According to customs data, China imported semiconductor and MEMS chips worth US$304 billion in 2019, down 2.6 percent on a yearly basis1. Moreover, the State Council of China has declared that the country aims to increase its self-sufficiency rate of chips to 70 percent from the 30 percent level realised in 2019. This type of semiconductor manufacturing goal and the government funds associated with it have been ongoing for more than a decade. Read the full article on CMM.

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MANCEF COMS World 2020

注册COMS World 2020， 了解中国MEMS/半导体 基础设施建设恢复情况。

Register for COMS World 2020 and learn about the resilience of the MEMS/Semi infrastructure in China

以下是此次分会的演讲嘉宾  Here are the speakers we have for this session: Lucy Huang (罕王微电子 CEO-Hanking Electronics), Sara Sun (KLA-SPTS), Jerry Li (沈阳硅基 Shenyang Silicon), Mike Rosa (AMAT), Eric Pabo (EVG), Roc Blumenthal, Tomas Bauer (Silex) and Doug Sparks. ( 罕王微电子 CTO-Hanking Electronics)

Hanking Electronics is a proud Bronze Sponsor of MANCEF COMSWORLD 2020. Our CEO, Lucy Huang and CTO, Dr. Doug Sparks will be speakers at this event. Register today! https://comsworld2020.com/
#mems #sensors #technologies #healthcare #security #environment #nanotechnology #iot #onlineevent #coms2020 #hankingelectronics #inovation

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Hanking’s CTO Dr. Doug Sparks Appointed to MANCEF Board of Directors

September 2019

MANCEF- Micro and Nano Commercialization Educational Foundation- is a non-profit organization comprised of an international group of passionate technology commercialization evangelists who’s goal is to accelerate the commercialization of emerging technology of all varieties. Doug is working to expand MANCEF across Asia.  https://www.mancef.org/

Dr. Douglas Sparks is the CTO at Hanking Electronics, which built China’s largest 200mm pure MEMS fab. Prior to joining Hanking he founded NanoGetters, was the Executive Vice President at Integrated Sensing Systems launching microfluidics products, and also worked at Delphi in the automotive MEMS and integrated circuits.

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Hanking’s Dir. of Technical Marketing & Support to Speak at Electronica

Leonardo Sala, Hanking’s Dir. of Technical Marketing and Support, will be a speaker at Electronica 2018 in Shanghai on MEMS technology.  Leonardo will discuss Hanking’s MEMS technology, that includes 3 DoF and 6DoF inertial sensors and China’s first high volume 8″ MEMS wafer foundry.  His speech will address Hanking’s development of its future to become the world leader in MEMS technology.

For more information: http://www.electronicachina.com/