Hanking Electronics specializes in MEMS design, fabrication and MEMS IMU products and related electronics components. Hanking is China’s first high volume 8″/ 200 mm MEMS foundry located in Fushun, China on over 51 hectares and a 513,950 m2 facility.
Hanking Electronics also offers patterned thin film getter foundry services for MEMS vacuum packaging. Integrated thin film getters can be used to improve the performance of wafer level vacuum packages and are often incorporated into IR, pressure sensors and resonators like gyroscopes and oscillators.
Its process capabilities cover those needed for MEMS pressure sensors, accelerometers, gyros, flow sensors and custom services are available for foundry customers. Hanking has an R&D center in Cleveland Ohio and engineering teams in Milan and Pisa, Italy.
Process Capabilities
- Film Deposition
- Metal Deposition
- Thermal
- Wafer Bonding
- Etch processes including DRIE and VHF
- Wet processes
- Wafer level packaging
Main Processes
| 1 | Film Deposition | Hi-K dielectric deposition |
| Polysilicon deposition | ||
| PECVD Oxide deposition | ||
| Low Temperature Oxide deposition | ||
| Antistiction film coating deposition | ||
| 2 | Metal Deposition | Seed layer deposition |
| Multilayer metal film deposition | ||
| Germanium sputtering | ||
| 3 | Thermal | Thermal Oxidation |
| Hi-K dielectric annealing | ||
| Oxide layer annealing | ||
| 4 | Wet | RCA clean |
| BOE | ||
| Wet etch silicon | ||
| Post DRIE wet clean | ||
| Wet remove photoresist | ||
| Pre-furnace clean | ||
| 5 | Wafer Bonding | Aluminum Germanium Eutectic bonding |
| Gold-Silicon Eutectic bonding | ||
| Fusion | ||
| Anodic | ||
| 6 | Etch | High aspect ratio etch DRIE |
| Vapor phase oxide etch | ||
| Rapid Silicon etch | ||
| Metal etch | ||
| Backside etch | ||
| Polysilicon etch | ||
| Hi-K dielectric etch | ||
| Oxide etch | ||
| 7 | Lithography | Photoresist coating |
| Photoresist spray | ||
| Full field aligner exposure | ||
| DRIE 5x stepper exposure | ||
| Lift off |