Our CEO Lucy Huang was featured in this recent article in the latest issue of Fierce Electronics.
Chip shortages have been seen in the global supply chain in the past year in MEMS as well as ICs (Integrated Circuits). This will drive investment and growth in the MEMS foundry business. Prior to the COVID shutdowns, the MEMS foundry business in China had already moved from 100- & 150-mm MEMS fabs as well as CMOS (Complementary Metal Oxide Semiconductor) surface micromachining to large 200mm MEMS wafer fabs.
There are several different basic MEMS process technologies such as capacitive, piezoresistive, magnetic and piezoelectric processes. To accommodate this range of processes a foundry must be flexible to meet a wide range of customer requirements. Materials like gold, scandium, zirconium, and process that are not compatible with CMOS foundries are able to be manufactured in dedicated MEMS wafer fabs.
This approach enables new technologies and materials like piezoelectric and IR sensors and actuators to be fabricated for large volume consumer applications. Turn-key solutions with PDKs (Process Design Kits) and developed processes are preferred by global and Chinese customers and Hanking Electronics offers design-fab-assembly services. We see many foundry customers who want to expand more local, Chinese wafer fab content to meet regional needs going forward into 2022 and beyond.